High Speed 2D & 3D Solder Print Inspection System



Features of BPC-330SE

  • High Speed full 3D (M size PCB) in 21 seconds
  • High precision: 24 or 12 micron resolution
  • Telecentric lens system
  • Bi-directional measurements with 3D laser
  • Full touch panel display and operation control
  • Barcode system for data management and control
  • Supports a multi-line control system