RD500-SIII BGA Rework Equipment


For The Removal and Replacement of BGA, CSP, LGA, QFP, PLCC and other Components 

Features

  • For stable and safe rework
  • Auto-Profiling
  • High Resolution Dual Prism Optics
    • Displayed on PCs LCD Monitor
    • Accurate to +/- 0.025 mm
  • Various Automated Functions
  • Powerful Heating System
  • PC Controlled
  • Max 400 X 420 mm Board
  • Max 500 X 600 mm Board (RD500-III model)